Mo–Cu芯材表面状态对多层Cu/MoCu/Cu复合材料界面结合的影响
宋鹏, 李达, 韩蕊蕊, 熊宁, 张保红, 姚惠龙
Effects of surface state for Mo–Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites
SONG Peng, LI Da, HAN Ruirui, XIONG Ning, ZHANG Baohong, YAO Huilong
粉末冶金技术
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2023, (3): 249
-254,262
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DOI: 10.19591/j.cnki.cn11-1974/tf.2023040007
