Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

Qilong Guan, Chunjin Hang, Shengli Li, Dan Yu, Ying Ding, Xiuli Wang, Yanhong Tian

Chinese Journal of Mechanical Engineering ›› 2023, Vol. 36 ›› Issue (2) : 22-22.

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Chinese Journal of Mechanical Engineering ›› 2023, Vol. 36 ›› Issue (2) : 22-22. DOI: 10.1186/s10033-023-00834-4
2023-4-25

Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 36(2): 22-22 https://doi.org/10.1186/s10033-023-00834-4

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