Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

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Chinese Journal of Mechanical Engineering ›› 2023, Vol. 36 ›› Issue (2) : 22-22. DOI: 10.1186/s10033-023-00834-4

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Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2023, 36(2): 22-22 https://doi.org/10.1186/s10033-023-00834-4

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 36(2): 22-22 https://doi.org/10.1186/s10033-023-00834-4

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