Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding

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Chinese Journal of Mechanical Engineering ›› 2018, Vol. 31 ›› Issue (4) : 70-70. DOI: 10.1186/s10033-018-0266-x

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Numerical Study on the Stress-Strain Cycle of Thermal Self-Compressing Bonding

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2018, 31(4): 70-70 https://doi.org/10.1186/s10033-018-0266-x

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 31(4): 70-70 https://doi.org/10.1186/s10033-018-0266-x

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