Bonding mechanisms of SiO<sub>2</sub> glass and 1060 Al by ultrasonic assisted active metal soldering process

Xiaowei Wu, Junhong Fu, Shoujing Wei, Hongjie Dong, Jian Wang, Haoran Wang, Xiaoguo Song, Zhuolin Li

China Welding . 2023, (2): 52 -62 . DOI: 10.12073/j.cw.20230308001