Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process

Xiaowei Wu, Junhong Fu, Shoujing Wei, Hongjie Dong, Jian Wang, Haoran Wang, Xiaoguo Song, Zhuolin Li

China Welding ›› 2023, Vol. 32 ›› Issue (2) : 52-62.

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China Welding ›› 2023, Vol. 32 ›› Issue (2) : 52-62. DOI: 10.12073/j.cw.20230308001

Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(2): 52-62 https://doi.org/10.12073/j.cw.20230308001

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