Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process
武晓伟, 符军红, 卫首敬, 董红杰, 王健, 王浩然, 宋晓国, 李卓霖
Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process
Xiaowei Wu, Junhong Fu, Shoujing Wei, Hongjie Dong, Jian Wang, Haoran Wang, Xiaoguo Song, Zhuolin Li
中国焊接
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2023, (2): 52
-62
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DOI: 10.12073/j.cw.20230308001
