Fluxless bonding with silver nanowires aerogel in die-attached interconnection
傅必成, 方毅, 张乐, 李道会, 齐放, 宋利军, 祝温泊
Fluxless bonding with silver nanowires aerogel in die-attached interconnection
Bicheng Fu, Yi Fang, Le Zhang, Daohui Li, Fang Qi, Lijun Song, Wenbo Zhu
中国焊接
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2023, (2): 32
-41
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DOI: 10.12073/j.cw.20230227001
