Multivariate Coupled Statistics Monitoring of Wafer Manufacturing Overlay Errors Based on Copula

HAO Lanyu, ZHOU Di, LI Yanting, PAN Ershun

China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (3) : 369-377.

PDF(7179 KB)
PDF(7179 KB)
China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (3) : 369-377. DOI: 10.3969/j.issn.1004/132X.2023.03.014

Multivariate Coupled Statistics Monitoring of Wafer Manufacturing Overlay Errors Based on Copula

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 34(3): 369-377 https://doi.org/10.3969/j.issn.1004/132X.2023.03.014

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(7179 KB)

Accesses

Citation

Detail
Sections
Recommended
　 Copyright © China Mechanical Engineering, All Rights Reserved.
Powered by Beijing Magtech Co. Ltd,.

/

〈 〉