Interface Quality Detection of Double-layer Bonding Structures Based on Ultrasonic Guided Wave Technology

WU Hui, LI Xiaogao, SHEN Guolang, WANG Xinguo, MA Chenwen

China Mechanical Engineering ›› 2024, Vol. 35 ›› Issue (05) : 916-927.

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China Mechanical Engineering ›› 2024, Vol. 35 ›› Issue (05) : 916-927. DOI: 10.3969/j.issn.1004-132X.2024.05.017

Interface Quality Detection of Double-layer Bonding Structures Based on Ultrasonic Guided Wave Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 35(05): 916-927 https://doi.org/10.3969/j.issn.1004-132X.2024.05.017

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