A Wafer Cycle Processing Time Prediction Method Incorporating Double Attention Mechanism and Parallel GRU

DAI Jiabin, ZHANG Jie, WU Lihui

China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (14) : 1640-1646.

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China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (14) : 1640-1646. DOI: 10.3969/j.issn.1004-132X.2023.14.001

A Wafer Cycle Processing Time Prediction Method Incorporating Double Attention Mechanism and Parallel GRU

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 34(14): 1640-1646 https://doi.org/10.3969/j.issn.1004-132X.2023.14.001

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