An Experimental Investigation of Laser Assisted Waterjet Microgrooving of GaAs Wafers

DUAN Lingyun, HUANG Chuanzhen, LIU Dun, YAO Peng, LIU Hanlian

China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (10) : 1172-1183.

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China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (10) : 1172-1183. DOI: 10.3969/j.issn.1004-132X.2023.10.006

An Experimental Investigation of Laser Assisted Waterjet Microgrooving of GaAs Wafers

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 34(10): 1172-1183 https://doi.org/10.3969/j.issn.1004-132X.2023.10.006

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