Surface Quality of Ultra-precision Grinding of Silicon with Fine Diamond Grinding Wheels

doi:10.3969/j.issn.1004-132X.2023.02.015

WANG Ziguang, LIU Jinxin, YIN Jian, ZHOU Ping, SHA Zhihua, KANG Renke

China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (02) : 245-251.

PDF(11656 KB)

China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (02) : 245-251. DOI: 10.3969/j.issn.1004-132X.2023.02.015

Surface Quality of Ultra-precision Grinding of Silicon with Fine Diamond Grinding Wheels

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 34(02): 245-251 https://doi.org/10.3969/j.issn.1004-132X.2023.02.015

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(11656 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Published
2021-06-02	2023-01-25
Issue Date
2023-02-16

Please choose a citation manager

Content to export