Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets

doi:10.3969/j.issn.1004-132X.2021.19.012

GAO Kun, LI Yingxiang, QI Lehua, WU Lang, ZHOU Yi, DOU Yibo, LUO Jun

China Mechanical Engineering ›› 2021, Vol. 32 ›› Issue (19) : 2367-2373.

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China Mechanical Engineering ›› 2021, Vol. 32 ›› Issue (19) : 2367-2373. DOI: 10.3969/j.issn.1004-132X.2021.19.012

Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 32(19): 2367-2373 https://doi.org/10.3969/j.issn.1004-132X.2021.19.012

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Received	Published
2021-02-10	2021-10-10
Issue Date
2021-11-05

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