×
模态框(Modal)标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框(Modal)标题
×
ISSN 1674-5949 CN 31-2023/U
Toggle navigation
Home
About Journal
Editorial Board
Instruction
Subscription
Journal Online
Just Accepted
Current Issue
Archive
Most Read
Most Download
Most Cited
E-mail Alert
RSS
Download
Ethical Guidelines
Contact Us
中文
Effects of Current Density on Residual Resistivity Ratio of Electrodeposited Copper Films
ZHANG Shuai, LUO Jirun, WANG Xiaoxia, ZHANG Rui, WU Zhijie, FENG Haijiao
China Surface Engineering . 2021, (
4
): 60 -66 . DOI: 10.11933/j.issn.1007-9289.20210201001