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ISSN 1674-5949 CN 31-2023/U
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中文
Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel
SHEN Zhongbao, QIU Ranfeng, SHI Hongxin, MA Hengbo
Transactions of The China Welding Institution . 2019, (
6
): 58 -63 . DOI: 10.12073/j.hjxb.2019400155
