Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel

SHEN Zhongbao, QIU Ranfeng, SHI Hongxin, MA Hengbo

Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (6) : 58-63.

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Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (6) : 58-63. DOI: 10.12073/j.hjxb.2019400155

Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 40(6): 58-63 https://doi.org/10.12073/j.hjxb.2019400155

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