Analysis of stress and strain in BGA solder joints under power cyclic load

GAO Chao, HUANG Chunyue, LIANG ying, LIU Shoufu, ZHANG Huaiquan

Transactions of The China Welding Institution ›› 2023, Vol. 44 ›› Issue (7) : 63-70.

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Transactions of The China Welding Institution ›› 2023, Vol. 44 ›› Issue (7) : 63-70. DOI: 10.12073/j.hjxb.20220811004
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Analysis of stress and strain in BGA solder joints under power cyclic load

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(7): 63-70 https://doi.org/10.12073/j.hjxb.20220811004

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