Reliability analysis of solder layer of IGBT module under passive thermal cycling

ZENG Jie, TAN Haohao, YANG Fang, ZHOU Wangjun, LI Liangxing, CHANG Guiqin, LUO Haihui

Transactions of The China Welding Institution ›› 2023, Vol. 44 ›› Issue (7) : 123-128.

PDF(2269 KB)
PDF(2269 KB)
Transactions of The China Welding Institution ›› 2023, Vol. 44 ›› Issue (7) : 123-128. DOI: 10.12073/j.hjxb.20220517002
Research paper

Reliability analysis of solder layer of IGBT module under passive thermal cycling

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(7): 123-128 https://doi.org/10.12073/j.hjxb.20220517002

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2269 KB)

Accesses

Citation

Detail
Sections
Recommended
　 Copyright © Transactions of The China Welding Institution, All Rights Reserved.
Powered by Beijing Magtech Co. Ltd,.

/

〈 〉