Preparation of Ag-Cu solid solution nanoparticles and the properties of low temperature sintered interconnect joint

QI Miaomiao, HE Xiaobin, LIU Shuangbao, YANG Wanchun, ZHU Wenbo

Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (7) : 97-101.

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Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (7) : 97-101. DOI: 10.12073/j.hjxb.20220220001

Preparation of Ag-Cu solid solution nanoparticles and the properties of low temperature sintered interconnect joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(7): 97-101 https://doi.org/10.12073/j.hjxb.20220220001

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