Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder

YAN Lijing, ZHOU Minbo, ZHAO Xingfei

Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (5) : 79-83.

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Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (5) : 79-83. DOI: 10.12073/j.hjxb.2019400131

Effect of solidification condition and strain rate on tensile properties and fracture behavior of Sn-58Bi solder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 40(5): 79-83 https://doi.org/10.12073/j.hjxb.2019400131

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