IGBT模块焊层的被动热循环可靠性分析
曾杰, 檀浩浩, 杨方, 周望君, 李亮星, 常桂钦, 罗海辉
Reliability analysis of solder layer of IGBT module under passive thermal cycling
ZENG Jie, TAN Haohao, YANG Fang, ZHOU Wangjun, LI Liangxing, CHANG Guiqin, LUO Haihui
焊接学报
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2023, (7): 123
-128
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DOI: 10.12073/j.hjxb.20220517002
