通过机械混合的方法，制备Sn1.0Ag0.5Cu-xAl复合钎料.采用DSC、STR-1000型微焊点强度测试仪及SEM，研究了纳米铝颗粒对低银Sn1.0Ag0.5Cu钎料组织与性能的影响.结果表明，微量纳米铝颗粒的添加对钎料的熔化温度影响较小，其熔点均在226.9~229.0℃之间.随着纳米Al元素含量的增加，钎料的润湿角逐渐减小，力学性能逐渐增加，当纳米Al元素的添加量为0.1%时，焊点的拉伸力达到最大，为7.1 N.此外，Sn1.0Ag0.5Cu-0.1Al钎料的内部组织得到显著细化，焊点界面金属间化合物的生长也得到明显抑制，主要归因于纳米颗粒对金属间化合物生长的吸附作用.
Sn1.0Ag0.5Cu-xAl composite solders were prepared by mechanically mixing method. The effect of nano Al particles on the microstructure and properties of Sn1.0Ag0.5Cu solder were investigated by differnetial scanning calorimetry, STR-1000 micro-joint strength tester and SEM. The results showed that adding nano Al particles does not cause a considerable change in the melting temperature. All samples ranged from 226.9 to 229℃. With the addition of nano Al particles, the wetting angle was decreased and mechanical property was increased. When the addition of nano Al particles was 0.1%, the pull force of solder joint reached the maximum, which was 7.1 N. In addition, the microstructure of Sn1.0Ag0.5Cu-0.1Al solder was significantly refined, and the thickness of interfacial intermetallic compounds (IMC) was effectively inhibited, which may attributed to the adsorption of nanoparticles.
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