Size effects on reaction and evolution of intermetallic compound and mechanical properties of Sn3.0Ag0.5Cu/ENEPIG/Cu solder joints in ball grid array (BGA) packages

WANG Hai-yan, SHI Yong-hua, CUI Guo-tao, GONG Chang-qing, LIU Zhi-yong

Transactions of Materials and Heat Treatment ›› 2023, Vol. 44 ›› Issue (8) : 211-218.

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Transactions of Materials and Heat Treatment ›› 2023, Vol. 44 ›› Issue (8) : 211-218. DOI: 10.13289/j.issn.1009-6264.2023-0007

Size effects on reaction and evolution of intermetallic compound and mechanical properties of Sn3.0Ag0.5Cu/ENEPIG/Cu solder joints in ball grid array (BGA) packages

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(8): 211-218 https://doi.org/10.13289/j.issn.1009-6264.2023-0007

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