Microstructure and properties evolution and failure mechanism of solder joints after thermal cycling

WANG Dong-mei, LIU Guang-tong, YOU Yi-liang, ZHANG Cheng, ZHANG Wei

Transactions of Materials and Heat Treatment ›› 2023, Vol. 44 ›› Issue (1) : 164-171.

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Transactions of Materials and Heat Treatment ›› 2023, Vol. 44 ›› Issue (1) : 164-171. DOI: 10.13289/j.issn.1009-6264.2022-0254

Microstructure and properties evolution and failure mechanism of solder joints after thermal cycling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(1): 164-171 https://doi.org/10.13289/j.issn.1009-6264.2022-0254

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