Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Liang Zhang, Weimin Long, Sujuan Zhong

Chinese Journal of Mechanical Engineering ›› 2021, Vol. 34 ›› Issue (6) : 115-115.

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Chinese Journal of Mechanical Engineering ›› 2021, Vol. 34 ›› Issue (6) : 115-115. DOI: 10.1186/s10033-021-00640-w
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Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 34(6): 115-115 https://doi.org/10.1186/s10033-021-00640-w

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