Intelligent Manufacturing Technology

Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

  • Jianhua Xiang ,
  • Liangming Deng ,
  • Chao Zhou ,
  • Hongliang Zhao ,
  • Jiale Huang ,
  • Sulian Tao
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  • 1. School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, China;
    2. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China;
    3. Department of Mechanical Engineering, Guangdong Technical College of Water Resources and Electric Engineering, Guangzhou, 510925, China

收稿日期: 2020-10-07

  修回日期: 2022-03-09

  网络出版日期: 2022-06-30

基金资助

Supported by the National Natural Science Foundation of China (Grant Nos. 51975135 and 52005422), Guangzhou Science and Technology Project (Grant No. 201707010429) and Special Innovation Projects of Universities in Guangdong Province (Grant No. 2018GKTSCX085)

Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

  • Jianhua Xiang ,
  • Liangming Deng ,
  • Chao Zhou ,
  • Hongliang Zhao ,
  • Jiale Huang ,
  • Sulian Tao
Expand
  • 1. School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, China;
    2. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China;
    3. Department of Mechanical Engineering, Guangdong Technical College of Water Resources and Electric Engineering, Guangzhou, 510925, China

Received date: 2020-10-07

  Revised date: 2022-03-09

  Online published: 2022-06-30

Supported by

Supported by the National Natural Science Foundation of China (Grant Nos. 51975135 and 52005422), Guangzhou Science and Technology Project (Grant No. 201707010429) and Special Innovation Projects of Universities in Guangdong Province (Grant No. 2018GKTSCX085)

摘要

With the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In this study, thermal resistance theoretical model of the micro-channel heat sink was first established. Then, fabrication process of the micro-channel heat sink was introduced. Subsequently, heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform. Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application. Moreover, the micro-channel structures in the heat sink were optimized by orthogonal test. Based on the orthogonal optimization, heat dissipation performance of the micro-channel radiator was further improved.

本文引用格式

Jianhua Xiang , Liangming Deng , Chao Zhou , Hongliang Zhao , Jiale Huang , Sulian Tao . Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink[J]. Chinese Journal of Mechanical Engineering, 2022 , 35(2) : 38 -38 . DOI: 10.1186/s10033-022-00704-5

Abstract

With the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In this study, thermal resistance theoretical model of the micro-channel heat sink was first established. Then, fabrication process of the micro-channel heat sink was introduced. Subsequently, heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform. Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application. Moreover, the micro-channel structures in the heat sink were optimized by orthogonal test. Based on the orthogonal optimization, heat dissipation performance of the micro-channel radiator was further improved.

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