Chinese Journal of Mechanical Engineering >

2021 , Vol. 34 >Issue 6: 145 - 145

DOI: https://doi.org/10.1186/s10033-021-00632-w

Research article

Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves

  • Ding Yuan ,
  • Wei Zhou ,
  • Ting Fu ,
  • Qingyu Dong
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  • 1 Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China;
    2 Key Laboratory of Metallurgical Equipment and Control Technology, Wuhan University of Science and Technology, Wuhan, 430081, China
Ding Yuan, is currently apostdoctoral fellow at the Department of Mechanical & Electrical Engineering, Xiamen University, China. She received her doctoral degree from South China University of Technology, China, in 2018. Her research interests include micro and nano manufacturing technology, microchannel heat exchangers, and heat and mass transfer;
Wei Zhou, is currently aProfessor at the Department of Mechanical & Electrical Engineering, Xiamen University, China.;
Ting Fu, is currently anassociate professor at the Key Laboratory of Metallurgical Equipment and Control Technology, Wuhan University of Science and Technology, China

收稿日期: 2020-08-30

  修回日期: 2021-09-05

  网络出版日期: 2022-04-03

基金资助

Supported by the Natural Science Foundation of China (Grant No. 51922092), Natural Science Foundation of Fujian Province of China (Grant No. 2017J06015), the Equipment Pre-research Foundation of China (Grant No. 61409230206), Open Fund of the Key Laboratory for Metallurgical Equipment and Control of Ministry of Education in Wuhan University of Science and Technology (Grant No. MECOF2019A01).

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Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves

  • Ding Yuan ,
  • Wei Zhou ,
  • Ting Fu ,
  • Qingyu Dong
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  • 1 Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China;
    2 Key Laboratory of Metallurgical Equipment and Control Technology, Wuhan University of Science and Technology, Wuhan, 430081, China

Received date: 2020-08-30

  Revised date: 2021-09-05

  Online published: 2022-04-03

Supported by

Supported by the Natural Science Foundation of China (Grant No. 51922092), Natural Science Foundation of Fujian Province of China (Grant No. 2017J06015), the Equipment Pre-research Foundation of China (Grant No. 61409230206), Open Fund of the Key Laboratory for Metallurgical Equipment and Control of Ministry of Education in Wuhan University of Science and Technology (Grant No. MECOF2019A01).

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摘要

To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface (type A) was designed. A comparative study of heat transfer was conducted regarding the performances of type A microchannels, microchannels embedded with grooves on their bottom (including types B and C), or on the sidewalls (type D) as well as smooth rectangular microchannels (type E) via a three-dimensional numerical simulation and experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that the average Nusselt number of types A, B, C, and D microchannels were 106, 73.4, 50.1, and 12.6% higher than that of type E microchannel, respectively. The smallest synergy angle β and entropy generation number Ns,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis, which indicated that type A exhibited the best heat transfer performance. Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients, which contributed to enhanced heat transfer performance.

关键词： Microchannel; Connected grooves; Heat transfer enhancement; Performance evaluation

本文引用格式

Ding Yuan , Wei Zhou , Ting Fu , Qingyu Dong . Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves[J]. Chinese Journal of Mechanical Engineering, 2021 , 34(6) : 145 -145 . DOI: 10.1186/s10033-021-00632-w

Abstract

To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface (type A) was designed. A comparative study of heat transfer was conducted regarding the performances of type A microchannels, microchannels embedded with grooves on their bottom (including types B and C), or on the sidewalls (type D) as well as smooth rectangular microchannels (type E) via a three-dimensional numerical simulation and experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that the average Nusselt number of types A, B, C, and D microchannels were 106, 73.4, 50.1, and 12.6% higher than that of type E microchannel, respectively. The smallest synergy angle β and entropy generation number Ns,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis, which indicated that type A exhibited the best heat transfer performance. Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients, which contributed to enhanced heat transfer performance.

Key words： Microchannel; Connected grooves; Heat transfer enhancement; Performance evaluation

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