IMC-skeletons reinforced high-temperature interconnections through low-temperature TLP bonding and micron composite solders

Xiaoting Wang, Yuyang Zhu, Wenbo Zhu, Mingyu Li

China Welding ›› 2023, Vol. 32 ›› Issue (2) : 42-51.

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China Welding ›› 2023, Vol. 32 ›› Issue (2) : 42-51. DOI: 10.12073/j.cw.20230303001

IMC-skeletons reinforced high-temperature interconnections through low-temperature TLP bonding and micron composite solders

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(2): 42-51 https://doi.org/10.12073/j.cw.20230303001

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