Research progress on solder thermal interface materials

Research progress on solder thermal interface materials

Yang Jiang, Guisheng Zou, Chengjie Du, Lei Liu

China Welding ›› 2022, Vol. 31 ›› Issue (1) : 1-5.

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PDF(470 KB)

China Welding ›› 2022, Vol. 31 ›› Issue (1) : 1-5. DOI: 10.12073/j.cw.20211216001

Research progress on solder thermal interface materials

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 31(1): 1-5 https://doi.org/10.12073/j.cw.20211216001

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