IMC-skeletons reinforced high-temperature interconnections through low-temperature TLP bonding and micron composite solders

王晓婷, 朱宇阳, 祝温泊, 李明雨

Xiaoting Wang, Yuyang Zhu, Wenbo Zhu, Mingyu Li

中国焊接 . 2023, (2): 42 -51 . DOI: 10.12073/j.cw.20230303001