Research progress on solder thermal interface materials

Research progress on solder thermal interface materials

江阳, 邹贵生, 杜成杰, 刘磊

Research progress on solder thermal interface materials

Yang Jiang, Guisheng Zou, Chengjie Du, Lei Liu

中国焊接 . 2022, (1): 1 -5 . DOI: 10.12073/j.cw.20211216001