Detection of GIS Equipment Conductor Defects by X-ray Digital Imaging and Analysis of Defect Causes

HU Jiarui, LI Wenbo, LIU Chun, CHEN Hongdong, XIE Yi

Nondestructive Testing ›› 2017, Vol. 39 ›› Issue (9) : 76-79.

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Nondestructive Testing ›› 2017, Vol. 39 ›› Issue (9) : 76-79. DOI: 10.11973/wsjc201709019

Detection of GIS Equipment Conductor Defects by X-ray Digital Imaging and Analysis of Defect Causes

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 39(9): 76-79 https://doi.org/10.11973/wsjc201709019

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