Reliability in Electronic Packaging: Past, Now and Future

CHEN Zhiwen, MEI Yunhui, LIU Sheng, LI Hui, LIU Li, LEI Xiang, ZHOU Ying, GAO Xiang

Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (16) : 248-268.

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Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (16) : 248-268. DOI: 10.3901/JME.2021.16.248

Reliability in Electronic Packaging: Past, Now and Future

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 57(16): 248-268 https://doi.org/10.3901/JME.2021.16.248

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