Effect of temperature field on the thermal stress of arc spraying

  • GUAN Dashu ,
  • FANG Siyan ,
  • ZHOU Zhidan ,
  • CHEN Fuqiang ,
  • CHEN Mengmeng
Expand
  • 1. China University of Minding and Technology, Xuzhou 221008, China;
    2. Guangdong Polytechnic of Water Resources and Electric Engineering, Guangzhou 510610, China;
    3. Guangdong Research Institute of Water Resources and Hydropower, Guangzhou 510610, China

Received date: 2018-01-18

  Online published: 2019-10-14

Abstract

Basing on heat conduction principle of thermodynamics and the equilibrium principle of force and torque in mechanics of materials, one way of thermal stress analysis of an arc rapid forming coating and substrate considering temperature field was proposed to calculate the thermal stress of the coating and the substrate, which caused respectively by the decrease of temperature and the change of temperature field due to the heat conduction of substrate, resulting from the high temperature coating. Basing on generalized heat conduction equation assigned to both initial and boundary conditions, temperature distribution function at different positions in the direction of matrix thickness was derived. On the basis of the temperature distribution function, the temperature strain equation, the force and moment equation, the theoretical formula of thermal stress along with temperature field for coating and substrate was derived. The results showed that the thermal stress distribution between coating and matrix after spray forming can better reflected, also the quality of the coating to achieve thick coating can better controlled by this method.

Cite this article

GUAN Dashu , FANG Siyan , ZHOU Zhidan , CHEN Fuqiang , CHEN Mengmeng . Effect of temperature field on the thermal stress of arc spraying[J]. Transactions of The China Welding Institution, 2019 , 40(8) : 109 -112 . DOI: 10.12073/j.hjxb.2019400217

References

[1] Chen Y X, Liang X B, Liu Y, et al. Elastoplastic analysis of process induced residual stresses in thermally sprayed coatings[J]. Journal of Applied Physics, 2010, 108(1):013517.
[2] Kuroda S, Clyne T W. The origin and quantification of the quenching stress associated with splat cooling during spray deposition[C]//2nd Plasma Technik Symposium, Wohlen, 1991:273-284.
[3] Kuroda S, Clyne T W. The quenching stress in thermally sprayed coatings[J]. Thin Solid Films, 1991, 200:49-66.
[4] Matejicek J, Sampath S, Brand P C, et al. Quenching, thermal and residual stress in plasma sprayed deposits:NiCrA1Y and YSZ coatings[J]. Acta Materialia, 1999, 47(2):607-617.
[5] Stoney G G. The tension of metallic films deposited by electrolysis[J]. Proceedings of the Royal Society A, 1909, A82:172-175.
[6] Wenzelburger M, Escribano M. Modeling of thermally sprayed coatings on light metal substrates:layer growth and residual stress formation[J]. Surface and Coatings Technology, 2004, 180-181:429-435.
[7] Hsueh C H. Thermal stresses in elastic multilayer systems[J]. Thin Solid Films, 2002, 418:182-188.
[8] Gan Z H, Wah Ng H. Experiments and inelastic finite element analyses of plasma sprayed graded coating under cyclic thermal shock[J]. Materials Science and Engineering A, 2004, 385:314-324.
[9] Giannakopoulos A E, Suresh S, Finot M, et al. Elastoplastic analysis of thermal cycling:layered materials with compositional gradients[J]. Acta Metallurgica Materialia, 1995, 43(4):1335-1385.
[10] Stokes J, Looney L. FEA of residual stress during hvof thermal spraying[J]. Journal of Materials Engineering and Performance, 2009, 18(1):21-25.
[11] Stokes J, Looney L. Predicting quenching and cooling stresses within HVOF deposits[J]. Journal of Thermal Spray Technology, 2008, 17(5-6):908-914.
[12] Clyne T W. Interfacial effects in particulate, fibrous and layered composite materials[J]. Key Engineering Materials, 1996, 116-117:307-330.
[13] Clyne T W, Gill S C. Residual stresses in thermal spray coatings and their effect on interfacial adhesion:a review of recent worn[J]. Journal of Thermal Spray Technology, 1996, 5(4):401-418.
[14] Tsui Y C, Clyne T W. An analytical model for predicting residual stresses in progressively deposited coatings, Part 2:Cylindrical geometry[J]. Thin Solid Films, 1997, 306:34-51.
[15] Tsui Y C, Clyne T W. An analytical model for predicting residual stresses in progressively deposited coatings, Part 1:Planar geometry[J]. Thin Solid Films, 1997, 306:23-33.
[16] Hu Y Y, Huang W M. Elastic and elastic-plastic analysis of multilayer thin films:Closed-form solutions[J]. Journal of Applied Physics, 2004, 96:4154-4160.
[17] Zhang X C. Residual stresses in the ealstoplastic multilayer thin film structures:The cases of Si/A1 bilayer and Si/Al/SiO2 trilayer structures[J]. Journal of Applied Physics, 2008, 103:073505.
[18] 陶军,李冬青,王明罡,等.焊接过程热传导系数反演法[J].焊接学报, 2004, 25(6):87-88, 123 Tao Jun, Li Dongqing, Wang Minggang, et al. Inversion method of heat conduction coefficient in welding process[J]. Transactions of the China Welding Institution, 2004, 25(6):87-88, 123
Outlines

/