Effects of β-Sn grain orientation and temperature on the interfacial reaction in Cu/SAC305/Cu micro solder joints during aging

QIAO Yuanyuan, ZHANG Minghui, SUN Lungao, MA Haitao, ZHAO Ning

Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (4) : 32-41.

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Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (4) : 32-41. DOI: 10.12073/j.hjxb.20210930003

Effects of β-Sn grain orientation and temperature on the interfacial reaction in Cu/SAC305/Cu micro solder joints during aging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(4): 32-41 https://doi.org/10.12073/j.hjxb.20210930003

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