Size distribution and growth mechanism of interfacial intermetallic compounds in Sn3.0Ag0.5Cu/Cu reflow solder joints

YANG Linmei, MU Guowan

Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (4) : 61-67.

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Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (4) : 61-67. DOI: 10.12073/j.hjxb.20210915001

Size distribution and growth mechanism of interfacial intermetallic compounds in Sn3.0Ag0.5Cu/Cu reflow solder joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(4): 61-67 https://doi.org/10.12073/j.hjxb.20210915001

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