Influence of Cu substrate roughness on wettability of SnAgCu lead-free solder

ZHANG Zhihang, YANG Jian, YANG Zhen, HUANG Jihua, CHEN Shuhai

Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (1) : 22-28.

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Transactions of The China Welding Institution ›› 2022, Vol. 43 ›› Issue (1) : 22-28. DOI: 10.12073/j.hjxb.20210609002

Influence of Cu substrate roughness on wettability of SnAgCu lead-free solder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(1): 22-28 https://doi.org/10.12073/j.hjxb.20210609002

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