Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint

WU Jie, XUE Songbai, YU Zhihao, TAN Cheeleong, SUN Huabin, XU Yong

Transactions of The China Welding Institution ›› 2021, Vol. 42 ›› Issue (7) : 9-13.

PDF(2278 KB)
PDF(2278 KB)
Transactions of The China Welding Institution ›› 2021, Vol. 42 ›› Issue (7) : 9-13. DOI: 10.12073/j.hjxb.20201211002

Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 42(7): 9-13 https://doi.org/10.12073/j.hjxb.20201211002

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2278 KB)

Accesses

Citation

Detail
Sections
Recommended
　 Copyright © Transactions of The China Welding Institution, All Rights Reserved.
Powered by Beijing Magtech Co. Ltd,.

/

〈 〉