Research on the RF performance simulation of ultra-fine wire bonding of RF devices

WANG Shang, MA Jingxuan, YANG Dongsheng, XU Jiahui, HANG Chunjin, TIAN Yanhong

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Transactions of The China Welding Institution ›› 2021, Vol. 42 ›› Issue (10) : 1-7. DOI: 10.12073/j.hjxb.20201125001

Research on the RF performance simulation of ultra-fine wire bonding of RF devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 42(10): 1-7 https://doi.org/10.12073/j.hjxb.20201125001

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