Study on the mechanism of nano-copper particles sintering interconnection based on a non-isodiametric double sphere stacking model and Monte Carlo simulation

JIANG Dawei, FAN Jiajie, HU Dong, FAN Xuejun, ZHANG Guoqi

Transactions of The China Welding Institution ›› 2021, Vol. 42 ›› Issue (3) : 7-13.

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Transactions of The China Welding Institution ›› 2021, Vol. 42 ›› Issue (3) : 7-13. DOI: 10.12073/j.hjxb.20200911003

Study on the mechanism of nano-copper particles sintering interconnection based on a non-isodiametric double sphere stacking model and Monte Carlo simulation

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 42(3): 7-13 https://doi.org/10.12073/j.hjxb.20200911003

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