Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices

JIANG Nan, ZHANG Liang, LIU Zhiquan, XIONG Mingyue, LONG Weimin

Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (9) : 39-42.

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Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (9) : 39-42. DOI: 10.12073/j.hjxb.2019400232

Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 40(9): 39-42 https://doi.org/10.12073/j.hjxb.2019400232

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