Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure

ZHANG Shiyong, WANG Lifeng, BAI Yuhui, LIU Juan, JIA Keming

Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (8) : 124-130.

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Transactions of The China Welding Institution ›› 2019, Vol. 40 ›› Issue (8) : 124-130. DOI: 10.12073/j.hjxb.2019400220

Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 40(8): 124-130 https://doi.org/10.12073/j.hjxb.2019400220

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