Microstructures evolution of low silver SnAgCu solder joint

LIANG Weiliang, XUE Peng, HE Peng, ZHONG Sujuan, SUN Huawei

Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (11) : 39-42.

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Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (11) : 39-42. DOI: 10.12073/j.hjxb.2018390269

Microstructures evolution of low silver SnAgCu solder joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 39(11): 39-42 https://doi.org/10.12073/j.hjxb.2018390269

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