Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending

YIN Rui, HUANG Chunyue, HUANG Genxin, LU Liangkun, LIANG Ying

Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (8) : 23-27.

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Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (8) : 23-27. DOI: 10.12073/j.hjxb.2018390194

Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 39(8): 23-27 https://doi.org/10.12073/j.hjxb.2018390194

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