Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites

XU Dongxia, FAN Xiaojie, XU Guoxing, DING Lianzheng, CHEN Sijie, NIU Jitai

Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (7) : 125-128.

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Transactions of The China Welding Institution ›› 2018, Vol. 39 ›› Issue (7) : 125-128. DOI: 10.12073/j.hjxb.2018390189

Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 39(7): 125-128 https://doi.org/10.12073/j.hjxb.2018390189

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