功率循环载荷下BGA焊点应力与应变分析

高超, 黄春跃, 梁颖, 刘首甫, 张怀权

Analysis of stress and strain in BGA solder joints under power cyclic load

GAO Chao, HUANG Chunyue, LIANG ying, LIU Shoufu, ZHANG Huaiquan

焊接学报 . 2023, (7): 63 -70 . DOI: 10.12073/j.hjxb.20220811004