铝/钢固态焊接合界面金属间化合物生长机制

申中宝, 邱然锋, 石红信, 马恒波

Growth mechanism of intermetallic compounds at the solid-state joining interface of aluminum/steel

SHEN Zhongbao, QIU Ranfeng, SHI Hongxin, MA Hengbo

焊接学报 . 2019, (6): 58 -63 . DOI: 10.12073/j.hjxb.2019400155