纳米颗粒增强SAC0307锡膏焊点的分析

赵智力, 刘鑫, 李睿, 王鹏

Study on solder joint of SAC0307 solder paste reinforced by nano Ag/Cu particles

ZHAO Zhili, LIU Xin, LI Rui, WANG Peng

焊接学报 . 2018, (9): 95 -98 . DOI: 10.12073/j.hjxb.2018390231