建立叠层封装(packaging on packaging，POP)堆叠焊点有限元模型，基于ANAND本构方程，分析了热循环载荷下焊点应力分布状态及热疲劳寿命；基于灵敏度法分析了POP封装结构参数对焊点热应力的影响显著性；基于响应面法建立POP堆叠焊点热应力与结构参数的回归方程，并结合粒子群算法对结构参数进行了优化. 结果表明，焊点与铜焊盘接触处应力最大，该处会率先产生裂纹，上层焊点高度和下层焊点高度对POP堆叠焊点热应力影响较为显著；最优结构参数水平组合为上层焊点高度0.35 mm、下层焊点高度0.28 mm、中层印刷电路板厚度0.26 mm，优化后上、下两层焊点的最大热应力分别下降了0.816和1.271 MPa，延长了POP堆叠焊点热疲劳寿命.
The finite element model of packaging on packaging(POP) stacked solder joints was established, and the stress distribution state and thermal fatigue life of the solder joints under thermal cyclic load were analyzed based on the ANAND constitutive equation. The significance of the influence of the structural parameters of the POP package on the thermal stress of the solder joints was analyzed based on the sensitivity method. The regression equation of the thermal stress of the POP stacked solder joints and the structural parameters was established based on the response surface method, and the structural parameters were optimized by combining the particle swarm algorithm. The results show that the stress is highest at the contact between the solder joint and the copper solder disc, which is the location of the crack initiation. The upper and lower solder joint heights have a significant effect on the thermal stresses in POP stacked joints. The optimal combination of structural parameter levels is 0.35 mm for the upper solder joint height, 0.28 mm for the lower solder joint height and 0.26 mm for the middle PCB thickness, which reduces the maximum thermal stress of the upper and lower solder joints by 0.816 and 1.271 MPa, respectively, and prolongs the thermal fatigue life of POP stacked joints.
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